The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Sep. 17, 2018
Applicant:

Rajan Kumar, La Jolla, CA (US);

Inventor:

Rajan Kumar, La Jolla, CA (US);

Assignee:

OCELLA INC, Newberry, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H02J 7/02 (2016.01); H01M 2/02 (2006.01); H02J 50/10 (2016.01); H01M 10/42 (2006.01); H02J 7/00 (2006.01); H02J 50/40 (2016.01); H02J 7/35 (2006.01); B29C 65/72 (2006.01); H05K 1/16 (2006.01); G06F 1/16 (2006.01); H05K 3/28 (2006.01); H01M 6/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01M 2/0275 (2013.01); H01M 10/425 (2013.01); H02J 7/0042 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H02J 50/40 (2016.02); H05K 1/028 (2013.01); H05K 1/0274 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 3/4644 (2013.01); H05K 3/4691 (2013.01); B29C 65/72 (2013.01); B32B 2307/202 (2013.01); G06F 1/163 (2013.01); H01M 6/40 (2013.01); H02J 7/35 (2013.01); H05K 1/16 (2013.01); H05K 3/284 (2013.01); H05K 2201/05 (2013.01); H05K 2201/09 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A multilayer flexible electronics platform is an apparatus that allows modular thin-film electronics to be integrated into everyday flexible, flat objects such as pieces of clothing, material coatings, or wearable devices. The apparatus includes a flexible water-impermeable envelop, a flexible power-source layer, a flexible printed circuit board (PCB) layer, and a flexible accessory-interfacing layer. The flexible accessory-interfacing layer allows those modular thin-film electronics to be electronically and electrically attached to the apparatus. The flexible PCB layer allows the apparatus to control and manage those modular thin-film electronics. The flexible power-source layer is used to provide electrical power to those modular thin-film electronics. The flexible water-impermeable envelop protectively encloses those modular thin-film electronics and the aforementioned functional layers of the apparatus.


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