The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Jul. 06, 2011
Applicants:

Chandan Bhat, Goleta, CA (US);

Theodore Douglas Lowes, Lompoc, CA (US);

Julio Garceran, Cary, NC (US);

Bernd Keller, Santa Barbara, CA (US);

Inventors:

Chandan Bhat, Goleta, CA (US);

Theodore Douglas Lowes, Lompoc, CA (US);

Julio Garceran, Cary, NC (US);

Bernd Keller, Santa Barbara, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); F21V 19/00 (2006.01); F21Y 105/12 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); F21V 19/0055 (2013.01); F21Y 2105/10 (2016.08); F21Y 2105/12 (2016.08); F21Y 2115/10 (2016.08); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H05K 1/0373 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.


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