The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jan. 26, 2018
Applicant:
Tung-yi Wu, New Taipei, TW;
Inventor:
Tung-Yi Wu, New Taipei, TW;
Assignee:
Other;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); F28F 13/06 (2006.01); F28D 15/02 (2006.01); H01L 23/367 (2006.01); F28F 1/24 (2006.01); H01L 23/40 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); F28D 15/02 (2013.01); F28F 1/24 (2013.01); F28F 13/06 (2013.01); H01L 21/4878 (2013.01); H01L 23/367 (2013.01); H01L 23/4093 (2013.01); H05K 7/20 (2013.01); H05K 7/20509 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10522 (2013.01);
Abstract
A memory heat dissipation unit is disclosed. The memory heat dissipation unit includes a main body having a first portion, a second portion and a connection portion having two lateral edges separately connected to the first and the second portion. The first and the second portion have at least one first heat-receiving section and at least one second heat-receiving section formed thereon, respectively; and the first and the second heat-receiving section are correspondingly in contact with at least one memory chip each to exchange heat with the chips and accordingly cool the same.