The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Aug. 22, 2019
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Daisuke Hiratsuka, Yokohama, JP;

Nobuto Fujiwara, Hino, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 17/687 (2006.01); H02M 1/32 (2007.01); H01L 29/866 (2006.01); G01R 31/26 (2020.01); H02M 7/537 (2006.01); H03K 17/08 (2006.01);
U.S. Cl.
CPC ...
H03K 17/687 (2013.01); G01R 31/26 (2013.01); H01L 29/866 (2013.01); H02M 1/32 (2013.01); H02M 7/537 (2013.01); H03K 17/08 (2013.01);
Abstract

A semiconductor module according to embodiments includes a first external terminal, a second external terminal, a first semiconductor switch which is electrically connected between the first external terminal and the second external terminal and includes a first gate electrode, a second semiconductor switch which is electrically connected in parallel with the first semiconductor switch, between the first external terminal and the second external terminal, and includes a second gate electrode, a first fuse electrically connected between the first external terminal and the first semiconductor switch, and a second fuse electrically connected between the second external terminal and the first semiconductor switch.


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