The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
May. 25, 2018
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Scott W. Slabaugh, Gilroy, CA (US);
Kevin M. Kenney, San Jose, CA (US);
Michael B. Wittenberg, Sunnyvale, CA (US);
Erik G. de Jong, San Francisco, CA (US);
Christopher S. Graham, San Francisco, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H02J 50/10 (2016.01); H01F 38/14 (2006.01); H02J 7/02 (2016.01); H05K 5/02 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H02J 50/10 (2016.02); H01F 38/14 (2013.01); H02J 7/025 (2013.01); H04B 5/0081 (2013.01); H05K 5/0073 (2013.01); H05K 5/0247 (2013.01);
Abstract
Embodiments describe a housing for an electronic device that includes a non-conductive filament wound around a least a first portion of a perimeter of the housing, and a conductive filament wound around a least a second portion of the perimeter of the housing. The non-conductive filament and the conductive filament are adhered together to form the housing.