The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Jul. 22, 2019
Applicant:

Industrial Technology Research Institute, Hsin-Chu, TW;

Inventors:

Jiun-Jang Yu, Hsinchu, TW;

Chun-An Lu, New Taipei, TW;

Hong-Ching Lin, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/02 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01);
Abstract

An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.


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