The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Mar. 14, 2014
Applicant:

Wake Forest University, Winston-Salem, NC (US);

Inventors:

David L. Carroll, Winston-Salem, NC (US);

Robert Summers, Clemmons, NC (US);

Assignee:

WAKE FOREST UNIVERSITY, Winston-Salem, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/30 (2006.01); H01L 35/32 (2006.01); H01L 35/22 (2006.01); H01L 51/00 (2006.01); H01L 41/113 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/22 (2013.01); H01L 51/004 (2013.01); H01L 41/113 (2013.01);
Abstract

In one aspect, thermoelectric apparatus and articles and various applications of thermoelectric apparatus and articles are described herein. In some embodiments, a thermoelectric apparatus described herein comprises at least one p-type layer coupled to at least one n-type layer to provide a pn junction, and an insulating layer at least partially disposed between the p-type layer and the n-type layer, the p-type layer comprising carbon nanoparticles and the n-type layer comprising n-doped carbon nanoparticles. In some embodiments, the nanoparticles of the p-type layer and/or the nanoparticles of the n-type layer are disposed in a polymeric matrix comprising electrically poled polymer. In some embodiments, a thermoelectric article comprises a thermally insulating support and thermoelectric modules formed of a structure passing around or through the thermally insulating support to provide faces of the thermoelectric modules on opposing sides of the thermally insulating support.


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