The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Jul. 24, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Shinichiro Noudo, Kumamoto, JP;

Assignee:

Sony Corporation, Toyko, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/76 (2006.01); H04N 5/369 (2011.01); H01L 31/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14645 (2013.01); H01L 21/76 (2013.01); H01L 27/146 (2013.01); H01L 27/1463 (2013.01); H01L 27/14605 (2013.01); H01L 27/14683 (2013.01); H01L 27/14689 (2013.01); H01L 31/10 (2013.01); H04N 5/369 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01);
Abstract

To solve at least one of various problems in an image sensor in a 2PD scheme. A solid-state image pickup element includes a plurality of pixels each including a photoelectric conversion element formed on a silicon substrate, in which some pixels in the plurality of pixels each have the photoelectric conversion element partitioned by a first-type separating region extending in a plate shape in a direction along a thickness direction of the silicon substrate, and other pixels in the plurality of pixels each have the photoelectric conversion element partitioned by a second-type separating region formed with a material different from a material of the first-type separating region, the second-type separating region extending in a plate shape in the direction along the thickness direction of the silicon substrate.


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