The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Aug. 05, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/17 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01);
Abstract
A package-on-package and a package connection system including the same are provided. The package-on-package includes a first semiconductor package including a first semiconductor chip, and a second semiconductor package disposed on the first semiconductor package and including a second semiconductor chip electrically connected to the first semiconductor chip. The first semiconductor chip includes an application processor (AP) including a first image signal processor (ISP), and the second semiconductor chip includes a second image signal processor (ISP).