The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Mar. 05, 2020
Applicant:
Cerebras Systems Inc., Los Altos, CA (US);
Inventor:
Jean-Philippe Fricker, Los Altos, CA (US);
Assignee:
Cerebras Systems Inc., Los Altos, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 7/10 (2006.01); H01L 21/60 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/38 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/52 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 23/32 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/32 (2013.01); H01L 23/367 (2013.01); H01L 23/473 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H01L 2224/48137 (2013.01);
Abstract
The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.