The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Nov. 19, 2018
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Andrew McNamara, Austin, TX (US);

Swagata Kalve, West Lafayette, IN (US);

Assignee:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H05K 7/20409 (2013.01);
Abstract

Various integrated heat spreaders and methods of making the same are disclosed. In one aspect, an integrated heat spreader to provide thermal management of a first heat generating component on a circuit board is provided. The integrated heat spreader includes a shell that has an internal space, at least one inlet port to receive a coolant to cool the first heat generating component and at least one outlet port to discharge the coolant. Plural heat fins are connected to the shell in the internal space. The heat fins are selectively connectable to the shell in multiple arrangements to provide selected flow rates of the coolant in one or more regions of the internal space.


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