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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10840109 B1

PDFFull Text
Date of Patent:
Nov. 17, 2020

Filed:

Mar. 28, 2019

Terminal, molded product for power module provided with terminal, and method of manufacturing molded product for power module provided with terminal

Applicant:

Nagase & Co., Ltd., Osaka, JP;

Inventors:

Tamanobu Naruoka, Kyoto, JP;

Kenro Shibata, Tokyo, JP;

Assignee:

NAGASE & CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Rhadames Alonzo Miller

Int. Cl.
CPC ...
H01L 21/48 (2006.01); B29C 45/76 (2006.01); H01L 23/498 (2006.01); H01R 13/10 (2006.01); B29C 45/14 (2006.01); H05K 7/14 (2006.01); H01R 43/24 (2006.01); H01R 43/20 (2006.01); H01R 12/58 (2011.01);
U.S. Cl.
CPC ...
H01L 21/4846 (2013.01); B29C 45/14639 (2013.01); B29C 45/76 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01R 12/585 (2013.01); H01R 13/10 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H05K 7/1432 (2013.01); B29C 45/14065 (2013.01); B29C 45/14311 (2013.01); B29C 45/14418 (2013.01); B29C 45/14426 (2013.01); B29C 45/14467 (2013.01); B29C 2045/14139 (2013.01);
Abstract

There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method of manufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.

Find Patent Forward Citations

Naruoka, Tamanobu. (2020). Terminal, molded product for power module provided with terminal, and method of manufacturing molded product for power module provided with terminal (U.S. Patent No. 10840109). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10840109

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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