The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jan. 06, 2016
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/14 (2006.01); H01F 27/29 (2006.01); H01L 41/047 (2006.01); H01G 4/232 (2006.01); H01F 17/00 (2006.01); H01G 4/30 (2006.01); H01C 7/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01C 1/14 (2013.01); H01F 17/0013 (2013.01); H01G 4/232 (2013.01); H01L 41/0472 (2013.01); H01L 41/0477 (2013.01); H01C 7/008 (2013.01); H01G 4/30 (2013.01); H05K 3/321 (2013.01); H05K 2201/10636 (2013.01); Y02P 70/50 (2015.11);
Abstract
An electronic component includes an electronic component body and an external electrode. The external electrode is disposed on the electronic component body. The external electrode includes a Pd plating layer and a Ni plating layer. The Pd plating layer defines an outermost layer. The Ni plating layer is disposed inside the Pd plating layer. The Ni plating layer is partly exposed from the Pd plating layer.