The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

May. 10, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Il Ho Cha, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 27/02 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0006 (2013.01); H01F 27/022 (2013.01); H01F 27/29 (2013.01); H01F 41/042 (2013.01); H01F 2017/004 (2013.01);
Abstract

A thin film coil component includes a body and first and second external electrodes. The body includes a first coil having wound with respect to a first axial direction and having a first seed layers and a first coil plating layer formed disposed on the first seed layers; a second coil connected to the first coil, wound with respect to a second axial direction parallel to the first axial direction, and having a second seed layers and a second plating layer disposed on the second seed layers; a connection portion connecting the first coil and the second coil to each other and and disposed in a direction perpendicular to the first and second axial directions; and a sealing member sealing the first and second coils and the connection portion.


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Cha, Il. (2020). Thin film coil component (U.S. Patent No. 10840006). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10840006

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