The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

May. 16, 2017
Applicant:

Dongguan Littelfuse Electronics Company Limited, Dongguan, CN;

Inventors:

Shuying Liu, Dongguan, CN;

Ming Lei, Dongguan, CN;

Guoliang Chen, Dongguan, CN;

Youqun Sui, Dongguan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/108 (2006.01); H01C 1/142 (2006.01); H01C 17/28 (2006.01); H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
H01C 7/108 (2013.01); H01C 1/142 (2013.01); H01C 17/006 (2013.01); H01C 17/281 (2013.01);
Abstract

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers.


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