The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

May. 17, 2019
Applicants:

Raytheon Company, Waltham, MA (US);

University of Massachusetts, Boston, MA (US);

Inventors:

Erika C. Klek, Tewksbury, MA (US);

Mary K. Herndon, Littleton, MA (US);

Thomas V. Sikina, Harvard, MA (US);

James E. Benedict, North Chelmsford, MA (US);

Andrew R. Southworth, Lowell, MA (US);

Kevin M. Wilder, Derry, NH (US);

Oshadha K. Ranasingha, Salem, NH (US);

Alkim Akyurtlu, Arlington, MA (US);

Assignees:

Raytheon Company, Waltham, MA (US);

University of Massachusetts, Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/00 (2006.01); H01C 17/065 (2006.01); H01B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01C 7/003 (2013.01); H01B 3/10 (2013.01); H01C 17/06533 (2013.01);
Abstract

A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.


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