The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Apr. 26, 2018
Applicant:

Yageo Corporation, Kaohsiung, TW;

Inventors:

Shen-Li Hsiao, Kaohsiung, TW;

Kuang-Cheng Lin, Kaohsiung, TW;

Hwan-Wen Lee, Kaohsiung, TW;

Chih-Lung Chen, Kaohsiung, TW;

Assignee:

YAGEO CORPORATION, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/14 (2006.01); B23K 11/00 (2006.01); H01C 1/144 (2006.01); B23K 3/03 (2006.01); H01C 17/28 (2006.01);
U.S. Cl.
CPC ...
H01C 1/144 (2013.01); B23K 3/0307 (2013.01); B23K 11/002 (2013.01); H01C 17/28 (2013.01);
Abstract

In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.


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