The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Nov. 14, 2016
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventors:

Tetsuyuki Kubota, Yokohama, JP;

Akira Ueda, Yokohama, JP;

Hideharu Matsushita, Yokohama, JP;

akihiro otsuka, Yokohama, JP;

Yasuhiro Ite, Chofu, JP;

Takamasa Shinde, Kawasaki, JP;

Kazuhisa Inagaki, Yokohama, JP;

Akira Sakai, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 30/367 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01); G06F 2119/08 (2020.01);
Abstract

A temperature calculation method for a substrate, the temperature calculation method includes: calculating, by a computer performing a circuit simulation based on a resistance equivalent to a component that joins two substrates included in a target model of an analysis, a value of a current that flows through the component or voltage values in respective end portions of the component; setting, based on model information for expressing the target model, the current value or the voltage values in a first surface and a second surface that are included in surfaces of an outer shape of the component and that are in contact with the respective substrates; and calculating a first current density distribution of the component by performing a first electrical analysis according to the setting.


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