The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Oct. 20, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.