The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jun. 20, 2018
Applied Materials, Inc., Santa Clara, CA (US);
Robert B. Moore, Lewistown, MT (US);
David Silvetti, Morgan Hill, CA (US);
Paul Wirth, Kalispell, MT (US);
Randy Harris, Kalispell, MT (US);
Daniel J. Woodruff, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.