logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10837114 B1

PDFFull Text
Date of Patent:
Nov. 17, 2020

Filed:

Oct. 21, 2015

Composition for forming conductive pattern by irradiation of electromagnetic waves, method for forming conductive pattern using same, and resin structure having conductive pattern

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jae Hyun Kim, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Jae Jin Kim, Daejeon, KR;

Han Nah Jeong, Daejeon, KR;

Chee-Sung Park, Daejeon, KR;

Bu Gon Shin, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Assignee:

LG CHEM., LTD., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Robert S Walters, Jr

Int. Cl.
CPC ...
C23C 18/20 (2006.01); C08K 3/24 (2006.01); C23C 18/16 (2006.01); C25D 5/56 (2006.01); H01B 1/20 (2006.01); H01L 23/00 (2006.01); H01B 13/00 (2006.01); C08K 3/013 (2018.01); C08K 3/22 (2006.01); C08J 7/06 (2006.01); C25D 5/02 (2006.01); H01B 1/22 (2006.01); H01B 13/34 (2006.01); H05K 9/00 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
C23C 18/20 (2013.01); C08J 7/065 (2013.01); C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 3/24 (2013.01); C23C 18/1601 (2013.01); C23C 18/1608 (2013.01); C23C 18/1614 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C25D 5/024 (2013.01); C25D 5/56 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); H01B 13/00 (2013.01); H01B 13/348 (2013.01); H01L 24/00 (2013.01); H05K 9/0049 (2013.01); C23C 18/405 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1461 (2013.01);
Abstract

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<−log(Ls)<6.0.

Find Patent Forward Citations

Loading…