The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Aug. 23, 2016
Applicant:
Shin-etsu Polymer Co., Ltd., Tokyo, JP;
Inventor:
Sou Matsubayashi, Saitama, JP;
Assignee:
SHIN-ETSU POLYMER CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 165/00 (2006.01); C09D 5/24 (2006.01); C08L 65/00 (2006.01); C09D 167/00 (2006.01); C08J 7/04 (2020.01); H01B 1/12 (2006.01);
U.S. Cl.
CPC ...
C09D 165/00 (2013.01); C08J 7/0427 (2020.01); C08L 65/00 (2013.01); C09D 5/24 (2013.01); C09D 167/00 (2013.01); C08J 2325/06 (2013.01); C08J 2425/18 (2013.01); C08J 2465/00 (2013.01); H01B 1/127 (2013.01);
Abstract
A method for producing an antistatic molded article according to the present invention includes: a conductive film preparation step to obtain a conductive film by coating, and drying, a conductive polymer dispersion liquid containing a conductive composite that contains a π-conjugated conductive polymer and a polyanion, a polyvinyl alcohol, a binder component, and a dispersion medium for dispersing the conductive composite on at least one surface of a film substrate; and a molding step for subjecting the conductive film to molding.