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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10836148 B1

PDFFull Text
Date of Patent:
Nov. 17, 2020

Filed:

Dec. 01, 2016

Method for producing plate packs

Applicant:

Kienle + Spiess Gmbh, Sachsenheim, DE;

Inventor:

Björn Böker, Esslingen, DE;

Assignee:

Kienle + Spiess GmbH, Sachsenheim, DE;

Attorney:

Gudrun E. Huckett

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/12 (2006.01); B32B 15/00 (2006.01); C09J 5/02 (2006.01); H02K 15/02 (2006.01); B32B 7/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); F16B 11/00 (2006.01); B29C 65/48 (2006.01); B29C 65/76 (2006.01); B29C 65/72 (2006.01); B29C 65/52 (2006.01); B29C 65/74 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1284 (2013.01); B32B 7/12 (2013.01); B32B 15/00 (2013.01); B32B 37/18 (2013.01); B32B 38/0004 (2013.01); C09J 5/02 (2013.01); H02K 15/02 (2013.01); B29C 65/48 (2013.01); B29C 65/482 (2013.01); B29C 65/52 (2013.01); B29C 65/72 (2013.01); B29C 65/74 (2013.01); B29C 65/76 (2013.01); B29C 66/004 (2013.01); B29C 66/00461 (2013.01); B29C 66/026 (2013.01); B29C 66/028 (2013.01); B29C 66/41 (2013.01); B29C 66/45 (2013.01); B29C 66/71 (2013.01); B32B 2037/1261 (2013.01); B32B 2307/206 (2013.01); B32B 2457/00 (2013.01); C09J 2400/163 (2013.01); C09J 2400/166 (2013.01); C09J 2433/00 (2013.01); F16B 11/006 (2013.01);
Abstract

Plate packs are produced from a sheet-like starting product (), which is cut to form plates, which are stacked to form a plate pack. The plates within the plate stack are joined to one another by a bonding agent. The bonding agent used is a cyanoacrylate adhesive with a high temperature stability rating. It is applied to a wetting layer () for the adhesive. The wetting layer () is formulated to a pH in a region >7. The cyanoacrylate adhesive with a high temperature stability rating is able to spread on the wetting layer () such that effective wetting takes place, thus achieving quick and secure joining of the plates to one another.

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