The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Aug. 19, 2019
Seiko Epson Corporation, Tokyo, JP;
Yusuke Watanabe, Shiojiri, JP;
Kenta Anegawa, Matsumoto, JP;
Seiichiro Yamashita, Azumino, JP;
Kei Yokota, Matsumoto, JP;
Yuichi Sasage, Suwa, JP;
Kakeru Sasagawa, Matsumoto, JP;
Abstract
An injection molding apparatus includes a first upstream mold having a first gate opening into which a first molding material flows, a second upstream mold having a second gate opening into which a second molding material flows, a first injection unit injecting the first material through the first gate opening, a second injection unit injecting the second material through the second gate opening, and a downstream mold clampable with each of the first and second upstream molds. The second material is injected by the second injection unit after the first material is injected by the first injection unit. The second gate opening is separated further from the downstream mold than the first gate opening, and a volume of a second cavity partitioned by the second upstream mold and the downstream mold is larger than that of a first cavity partitioned by the first upstream mold and the downstream mold.