The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

May. 23, 2018
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Suguru Imamura, Kariya, JP;

Naohiro Hayashi, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 48/11 (2019.01); B28B 3/26 (2006.01); B30B 11/22 (2006.01); B29C 48/00 (2019.01); B28B 3/20 (2006.01);
U.S. Cl.
CPC ...
B28B 3/2672 (2013.01); B28B 3/269 (2013.01); B29C 48/0022 (2019.02); B29C 48/022 (2019.02); B29C 48/11 (2019.02); B30B 11/221 (2013.01); B28B 2003/203 (2013.01);
Abstract

A flow speed control plate is provided for use in combination with a die for forming a monolith. The flow speed control plate includes: a base plate having both a clay supply surface and a clay outflow surface that is to be superposed on a clay inflow surface of the die; clay flow holes which each penetrate the base plate and through which the clay flows from the clay supply surface to the clay outflow surface; and a positioning mechanism provided to position the flow speed control plate with respect to the die so that each of the clay flow holes of the flow speed control plate has its central axis arranged coaxially with a central axis of a corresponding one of clay inflow holes of the die. Moreover, a diameter of the clay flow holes is set to be smaller than a diameter of the corresponding clay inflow holes.


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