The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jul. 18, 2019
Applicant:
Denso Corporation, Kariya, JP;
Inventor:
Hiroyasu Sugiura, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H02K 11/33 (2016.01); B62D 5/04 (2006.01); H05K 3/42 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); B62D 5/0406 (2013.01); B62D 5/0463 (2013.01); H02K 11/33 (2016.01); H05K 1/0206 (2013.01); H05K 1/116 (2013.01); H05K 1/184 (2013.01); H05K 3/3447 (2013.01); H05K 3/42 (2013.01); H05K 2201/095 (2013.01);
Abstract
An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.