The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Apr. 17, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Aaron R. Cox, Sherman, CT (US);
William J. Grady, IV, Austin, TX (US);
Jason A. Matteson, Raleigh, NC (US);
Jason E. Minyard, Phoenix, AZ (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/367 (2006.01); H01L 23/46 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/02 (2013.01); H01L 23/367 (2013.01); H01L 23/46 (2013.01); H05K 7/2039 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H01L 23/40 (2013.01); H01L 2023/4056 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4935 (2015.01);
Abstract
A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.