The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Feb. 13, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mark J. Jeanson, Rochester, MN (US);

Darryl Becker, Rochester, MN (US);

Gerald Bartley, Rochester, MN (US);

Matthew S. Doyle, Chatfield, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4673 (2013.01); H05K 3/064 (2013.01); H05K 3/42 (2013.01); H05K 2201/09581 (2013.01); H05K 2203/0703 (2013.01); Y10T 29/49165 (2015.01);
Abstract

Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.


Find Patent Forward Citations

Loading…