The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Aug. 10, 2017
Applicants:

Schweizer Electronic Ag, Schramberg, DE;

Continental Automotive Gmbh, Hannover, DE;

Inventors:

Hubert Trageser, Igensdorf, DE;

Alexander Neumann, Rottweil, DE;

Assignees:

Schweizer Electronic AG, Schramberg, DE;

Continental Automotive GmbH, Hannover, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0256 (2013.01); H05K 1/09 (2013.01); H05K 3/061 (2013.01); H05K 3/243 (2013.01); H05K 3/244 (2013.01); H05K 3/3452 (2013.01); H05K 3/388 (2013.01); H05K 3/421 (2013.01); H05K 3/428 (2013.01); H05K 3/429 (2013.01); H05K 3/06 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0769 (2013.01); H05K 2201/0989 (2013.01);
Abstract

A circuit board (″) includes at last one insulating substrate layer (SL, SL, SL, SL, SL) and a plurality of electrically conductive copper coats (C, C, C) arranged on the at least one insulating substrate layer (SL, SL, SL, SL, SL), wherein at least one of the electrically conductive copper coats (C, C, C) is coated at least on both sides with a layer (HSI, HS, HS) made of a material for inhibiting electromigration, wherein on a layer (HS, HS) made of a material for inhibiting electromigration a further metal layer (M, M, M, M') is provided, which is in turn coated with a further layer (HS, HS′) made of a material for inhibiting electromigration.


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