The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Mar. 21, 2016
Applicant:

Ledvance Gmbh, Garching, DE;

Inventor:

Georg Rosenbauer, Wassertrudingen, DE;

Assignee:

LEDVANCE GMBH, Garching, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); B23K 26/21 (2014.01); H05K 3/00 (2006.01); H01L 33/64 (2010.01); B23K 26/14 (2014.01); B23K 26/16 (2006.01); B23K 26/70 (2014.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 3/30 (2006.01); H05K 1/05 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); B23K 26/14 (2013.01); B23K 26/16 (2013.01); B23K 26/21 (2015.10); B23K 26/703 (2015.10); H01L 33/64 (2013.01); H05K 1/181 (2013.01); H05K 3/0061 (2013.01); H05K 3/22 (2013.01); H05K 3/303 (2013.01); B23K 2101/42 (2018.08); H01L 2933/0075 (2013.01); H05K 1/028 (2013.01); H05K 1/05 (2013.01); H05K 2201/046 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10522 (2013.01); H05K 2203/082 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1581 (2013.01);
Abstract

An optoelectronic assembly is provided in different embodiments. The optoelectronic assembly has the following; a printed circuit board; at least one optoelectronic first component which is arranged on a first face of the printed circuit board; a heat sink which has a first surface that is arranged on a second printed circuit board face facing away from the first component, wherein a boundary surface extends between the second face and the first surface; and at least one first welding connection, by means of which the heat sink is directly connected to the printed circuit board in a bonded manner and which together with the boundary surface forms a first cut surface, the first component at least partly overlapping the cut surface.


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