The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Mar. 21, 2019
Applicants:

Beijing Xiaomi Mobile Software Co., Ltd., Beijing, CN;

Shanghai Imilab Technology Co., Ltd., Shanghai, CN;

Inventors:

Shoufeng Huang, Shanghai, CN;

Wang Liu, Shanghai, CN;

Hesong Wang, Shanghai, CN;

Li Zhang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 1/04 (2006.01); G06F 3/16 (2006.01); G10L 21/0216 (2013.01); H04R 1/02 (2006.01); H04R 5/027 (2006.01); H04R 5/04 (2006.01); H04R 1/40 (2006.01); G10L 21/0208 (2013.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); G06F 3/16 (2013.01); G06F 3/167 (2013.01); G10L 21/0216 (2013.01); H04R 1/028 (2013.01); H04R 1/403 (2013.01); H04R 5/027 (2013.01); H04R 5/04 (2013.01); G10L 2021/02082 (2013.01); G10L 2021/02166 (2013.01); H04R 2420/07 (2013.01);
Abstract

An electronic device mainboard includes a main body; an audio collecting component provided on the main body and configured to collect audio; a main controlling component provided on the main body, connected with the audio collecting component through a printed circuit printed on the main body and configured to receive and analyze the audio and then send out interaction instructions according to the audio; and an interaction component provided on the main body, connected with the main controlling component and configured to receive and execute the interaction instructions.


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