The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jun. 22, 2017
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventors:

Kazuhiro Washio, Mie, JP;

Yasuo Omori, Mie, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01R 43/02 (2006.01); H01R 4/02 (2006.01); B23K 101/32 (2006.01); B23K 101/36 (2006.01); H01R 13/405 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0228 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); H01R 4/024 (2013.01); H01R 4/028 (2013.01); H01R 43/0249 (2013.01); B23K 2101/32 (2018.08); B23K 2101/36 (2018.08); H01R 13/405 (2013.01);
Abstract

A method to manufacture an electrical connection assembly includes: preparing a wiring material () that has conductors and an insulation coating, and preparing a connector (CN) including terminals () each having an outward projecting portion () with a conductor connection surface () and an insulating housing (). The method proceeds by setting solder on the conductor connection surfaces () and then removing the insulation coating covering parts to be connected from surfaces of the conductors by melting or dissolving the insulation coating. The method also electrically connects the conductors of the parts to be connected to the conductor connection surfaces () by the solder by heating the parts of the respective conductors to be connected together with the solder while holding a state where the conductors of the wiring material () are arrayed at intervals from each other in an array direction.


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