The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

May. 01, 2019
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Jian Miremadi, Palo Alto, CA (US);

David A. Moore, Tomball, TX (US);

John Norton, Houston, TX (US);

Eduardo F. Velazquez, Mayaguez, PR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); H05K 1/18 (2006.01); H01R 13/11 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 12/707 (2013.01); H01R 12/716 (2013.01); H01R 13/113 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01);
Abstract

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.


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