The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jul. 21, 2015
Applicant:

Elringklinger Ag, Dettingen, DE;

Inventors:

Udo Hoenle, Rottenburg, DE;

Mark Laderer, Grabenstetten, DE;

Moritz Bertsch, Dettinqen/Erms, DE;

Ulrich Sauter, Metzingen, DE;

Assignee:

ElringKlinger AG, Dettingen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01R 4/20 (2006.01); H01R 43/048 (2006.01); H01R 4/02 (2006.01); H01R 43/28 (2006.01); H01R 43/058 (2006.01);
U.S. Cl.
CPC ...
H01R 4/18 (2013.01); H01R 4/029 (2013.01); H01R 4/20 (2013.01); H01R 43/048 (2013.01); H01R 43/28 (2013.01); H01R 43/058 (2013.01); Y10T 29/4922 (2015.01);
Abstract

To provide a method for producing an electrically conductive bond between an electrical line, which includes a plurality of individual conductors, and an electrically conductive component, including producing from a crimp element blank a crimp element enclosing portions of the individual conductors, the crimp element including a continuous side and a discontinuous side, at which edge regions of the crimp element lie opposite one another, and substance-to-substance bonding of the crimp element with a contact surface of the component, which is simple to carry out and nevertheless always results in a robust substance-to-substance bond between the crimp element and the component, it is proposed that the crimp element be produced in such a way that the continuous side of the crimp element includes two bearing surfaces which are spaced from one another, at which the crimp element is substance-to-substance bondable to the contact surface of the component.


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