The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Oct. 05, 2018
Applicant:

Anokiwave, Inc., San Diego, CA (US);

Inventors:

Gaurav Menon, San Marcos, CA (US);

Jonathan P. Comeau, San Diego, CA (US);

Andrew Street, San Diego, CA (US);

Scott Mitchell, San Diego, CA (US);

Robert J. McMorrow, Concord, MA (US);

Christopher Jones, San Diego, CA (US);

Assignee:

ANOKIWAVE, INC., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 17/00 (2006.01); H01Q 1/40 (2006.01); H01Q 3/40 (2006.01); H01Q 15/24 (2006.01); H01Q 21/06 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01L 23/367 (2013.01); H01Q 1/40 (2013.01); H01Q 3/40 (2013.01); H01Q 15/24 (2013.01); H01Q 17/00 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01);
Abstract

An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.


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