The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jun. 27, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Patryk Gumann, Tarrytown, NY (US);

Salvatore Bernardo Olivadese, Stamford, CT (US);

Robert Meinel, Briarcliff Manor, NY (US);

Christopher Surovic, Carmel, NY (US);

Raymond A. Watters, Clintondale, NY (US);

Jerry M. Chow, White Plains, NY (US);

Jay M. Gambetta, Yorktown Heights, NY (US);

David C. Mckay, Ossining, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/22 (2006.01); G06N 10/00 (2019.01); H01P 5/02 (2006.01); H01P 11/00 (2006.01); H03H 11/24 (2006.01); H03H 7/24 (2006.01);
U.S. Cl.
CPC ...
H01P 1/225 (2013.01); G06N 10/00 (2019.01); H01P 5/026 (2013.01); H01P 11/00 (2013.01); H03H 7/24 (2013.01); H03H 11/24 (2013.01);
Abstract

The technology described herein is directed towards microwave attenuators, and more particularly to a cryogenic microwave attenuator device for quantum technologies. In some embodiments, a device can comprise a cryogenic microwave attenuator device. The cryogenic microwave attenuator device can comprise: a housing component and a microwave attenuator chip, wherein the housing component can have thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin. The cryogenic microwave attenuator device can also comprise a microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip.


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