The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jun. 20, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric Peter Lewandowski, White Plains, NY (US);

Bucknell C. Webb, Ossining, NY (US);

Jared Barney Hertzberg, Yorktown Heights, NY (US);

Martin O. Sandberg, Ossining, NY (US);

Oblesh Jinka, Stamford, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/16 (2006.01); H01L 39/24 (2006.01); H01L 39/02 (2006.01); G06N 10/00 (2019.01); H01L 23/367 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H01L 39/249 (2013.01); G06N 10/00 (2019.01); H01L 23/3672 (2013.01); H01L 23/488 (2013.01); H01L 39/2493 (2013.01);
Abstract

A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.


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