The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Sep. 05, 2017
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Kenichi Harigae, Tokyo, JP;

Hiroshi Kamiga, Tokyo, JP;

Noriaki Nogami, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0224 (2006.01); H01B 1/22 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 9/24 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); B22F 1/0059 (2013.01); H01B 1/22 (2013.01); H01L 31/0224 (2013.01); B22F 1/025 (2013.01); B22F 9/24 (2013.01); B22F 2001/0066 (2013.01); B22F 2301/255 (2013.01); B22F 2301/30 (2013.01); B22F 2302/256 (2013.01); H01L 31/02168 (2013.01); Y02P 70/50 (2015.11);
Abstract

A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.


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