The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Aug. 21, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jung Chul Gong, Suwon-si, KR;
Yong Ho Baek, Suwon-si, KR;
Young Sik Hur, Suwon-si, KR;
Joo Hwan Jung, Suwon-si, KR;
Yoo Rim Cha, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package module that is easily manufactured includes a first connection member including a wiring layer, a first passive component mounted on the first connection member, a first encapsulation portion encapsulating at least a portion of the first connection member and the first passive component, a semiconductor chip having an active surface with a connection pad disposed thereon and an inactive surface opposing the active surface and disposed in a first through-hole penetrating through the first connection member and the first encapsulation portion, a second encapsulation portion covering at least a portion of the semiconductor chip and encapsulating at least a portion of the first encapsulation portion and the first connection member, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad and the first passive component.