The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Aug. 02, 2019
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Tadashi Kosuga, Yokohama, JP;

Tin-Lup Wong, Morrisville, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 2224/10155 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81815 (2013.01);
Abstract

An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.


Find Patent Forward Citations

Kosuga, Tadashi. (2020). Interposer, electronic substrate, and method for producing electronic substrate (U.S. Patent No. 10833050). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10833050

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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