The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Dec. 17, 2018
Applicant:
Continental Automotive Systems, Inc., Auburn Hills, MI (US);
Inventors:
Jared Yagoda, Wauconda, IL (US);
Allyson Beuhler, Woodbridge, IL (US);
Assignee:
Vitesco Technologies USA, LLC, Auburn Hills, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/85 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/282 (2013.01); H05K 3/32 (2013.01); H05K 3/341 (2013.01); H01L 24/45 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45624 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/85214 (2013.01); H05K 3/0082 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/10 (2013.01); H05K 2203/107 (2013.01);
Abstract
A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.