The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Sep. 25, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Reiji Nakajima, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A circuit module () includes an electronic component (), a plurality of conductor posts (), a mold layer () that seals a plurality of the electronic components () and the plurality of conductor posts (), and a shield layer () on the mold layer (). The electronic components () include a first electronic component () and second electronic components (). The plurality of conductor posts () includes a group of conductor posts () traversing between the first electronic component () and the second electronic components (). The shield layer () includes a slit () that, with respect to each conductor post () included in the group () of conductor posts, in a plan view, passes and extends between the conductor post () and the first electronic component (), or between the conductor post () and the second electronic components ().