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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10832992 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Jul. 22, 2019

Die attach methods and semiconductor devices manufactured based on such methods

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Joachim Mahler, Regensburg, DE;

Giovanni Ragasa Garbin, Malacca, MY;

Chen Wen Lee, Ipoh Perak, MY;

Benjamin Reichert, Lappersdorf, DE;

Peter Strobel, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Calvin Lee

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/40 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 24/01 (2013.01); H01L 2224/01 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/29015 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01);
Abstract

A method includes providing a carrier, depositing a die attach material on the carrier, and arranging a semiconductor die on the die attach material, wherein a main surface of the semiconductor die facing the die attach material at least partly contacts the die attach material, wherein immediately after arranging the semiconductor die on the die attach material, a first maximum extension of the die attach material over edges of the main surface is less than about 100 micrometers.

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Mahler, Joachim. (2020). Die attach methods and semiconductor devices manufactured based on such methods (U.S. Patent No. 10832992). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10832992

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