The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Jun. 05, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3185 (2013.01); H01L 21/568 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 23/49816 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/73267 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.