The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2020
Filed:
Aug. 09, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Ji Min Choi, Hwaseong-si, KR;
Dong Ryul Lee, Suwon-si, KR;
Ho Ouk Lee, Seoul, KR;
Ji Young Kim, Yongin-si, KR;
Chang Hyun Cho, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 23/14 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 23/147 (2013.01); H01L 21/76205 (2013.01); H01L 21/76227 (2013.01); H01L 21/76229 (2013.01); H01L 27/10894 (2013.01);
Abstract
A semiconductor device includes a substrate having a semiconductor layer. A trench is formed within the semiconductor layer. A filling insulating film is disposed within the trench. An insertion liner is disposed within the filling insulating film. The insertion liner is spaced apart from the semiconductor layer and extends along the bottom surface of the trench.