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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10832853 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Jun. 09, 2017

Coil and coil production method

Applicant:

Ckd Corporation, Komaki-shi, Aichi, JP;

Inventors:

Akihiro Ito, Komaki, JP;

Masayuki Kouketsu, Komaki, JP;

Hideki Goda, Osaka, JP;

Takashi Tasaki, Osaka, JP;

Kazuhiro Izumoto, Osaka, JP;

Assignee:

CKD Corporation, Komaki-shi, JP;

Attorney:

Beyer Law Group LLP

Primary Examiner:

Alexander Talpalatski

Assistant Examiner:

Joselito Baisa

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 5/06 (2006.01); B32B 38/10 (2006.01); B29C 53/56 (2006.01); H01F 27/32 (2006.01); B32B 37/12 (2006.01); B32B 7/02 (2019.01); H01F 41/12 (2006.01); H02K 15/10 (2006.01); H02K 3/30 (2006.01); H01F 41/063 (2016.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); H01F 7/08 (2006.01); H01F 7/06 (2006.01); H02K 3/02 (2006.01); H02K 9/19 (2006.01); H02K 41/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); B29C 53/562 (2013.01); B32B 7/02 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); H01F 5/003 (2013.01); H01F 5/06 (2013.01); H01F 7/08 (2013.01); H01F 27/2876 (2013.01); H01F 27/322 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/063 (2016.01); H01F 41/122 (2013.01); H02K 3/30 (2013.01); H02K 15/10 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); H01F 2007/068 (2013.01); H01F 2027/2809 (2013.01); H02K 3/02 (2013.01); H02K 9/19 (2013.01); H02K 41/02 (2013.01);
Abstract

A coil sheet includes a conductor layer, a thermally resistant organic insulating layer, a thermosetting adhesive layer in a B-stage state, and a base layer, such that the conductor layer and the insulating layer are bonded to the base layer with the adhesive layer. A coil is formed of a laminate sheet including a conductor layer, an insulating layer, and an adhesive layer of the coil sheet which are released from the base layer thereof, wherein the laminate sheet is wound around a specific axis a plurality of times, and the adhesive layer is thermally cured.

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