The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jan. 21, 2020
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Tomoyuki Ishimatsu, Utsunomiya, JP;

Reiji Tsukao, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 5/16 (2006.01); H01R 13/24 (2006.01); H01L 23/00 (2006.01); C09J 7/10 (2018.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); H01B 1/22 (2006.01); H05K 3/32 (2006.01); H01R 12/70 (2011.01); C08K 3/08 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
H01B 5/16 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); C09J 7/10 (2018.01); H01B 1/22 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01R 13/2414 (2013.01); H05K 3/323 (2013.01); C08K 3/08 (2013.01); C08K 9/02 (2013.01); C09J 2201/36 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 24/32 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2924/07802 (2013.01); H01R 12/7076 (2013.01);
Abstract

The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.


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