The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Feb. 21, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Shawn C. Dodds, St. Paul, MN (US);

Matthew S. Stay, Minneapolis, MN (US);

Mikhail L. Pekurovsky, Bloomington, MN (US);

Matthew H. Frey, Cottage Grove, MN (US);

Mark J. Pellerite, Woodbury, MN (US);

John P. Baetzold, North St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 3/041 (2006.01); B82B 1/00 (2006.01); B82Y 15/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G06F 1/16 (2013.01); G06F 3/041 (2013.01); G06F 3/0412 (2013.01); B82B 1/002 (2013.01); B82Y 15/00 (2013.01); B82Y 40/00 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); Y10S 977/767 (2013.01); Y10S 977/887 (2013.01); Y10S 977/956 (2013.01);
Abstract

A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.


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