The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jun. 18, 2019
Applicant:

Nokia of America Corporation, Murray Hill, NJ (US);

Inventors:

Yee L. Low, New Providence, NJ (US);

Nagesh Basavanhally, Skillman, NJ (US);

Assignee:

Nokia of America Corporation, Murray Hill, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/43 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/4232 (2013.01); G02B 6/43 (2013.01); H05K 1/0274 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); G02B 2006/12104 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.


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