The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Aug. 08, 2016
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Seiji Nishimoto, Kariya, JP;

Tomoyuki Takiguchi, Kariya, JP;

Yoshiyuki Kono, Kariya, JP;

Akitoshi Mizutani, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/14 (2006.01); G01R 33/02 (2006.01); H01L 23/31 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
G01D 5/145 (2013.01); G01D 5/14 (2013.01); G01D 11/245 (2013.01); G01R 33/02 (2013.01); H01L 23/3107 (2013.01); H01L 23/3135 (2013.01);
Abstract

A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.


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